AMD has announced new 2nd-gen Ryzen PRO 3000-series mobile processors and a new Athlon PRO model, all of which feature RX Vega graphics and range up to a 4 core/8-thread offering with the Ryzen 7 PRO 3700U. These new mobile parts are based on the existing 12nm Zen+ architecture, not the upcoming 7nm Zen 2, and each part carries a 15W TDP.
| Product Model | Cores/Threads | TDP | Base/Boost Frequency | Radeon Graphics | GPU Cores | Max GPU Frequency | L2+L3 Cache |
|---|---|---|---|---|---|---|---|
| AMD Ryzen 7 PRO 3700U | 4C/8T | 15W | 2.3/4.0 GHz | Vega | 10 | 1400 MHz | 6MB |
| AMD Ryzen 5 PRO 3500U | 4C/8T | 15W | 2.1/3.7 GHz | Vega | 8 | 1200 MHz | 6MB |
| AMD Ryzen 3 PRO 3300U | 4C/4T | 15W | 2.1/3.5 GHz | Vega | 6 | 1200 MHz | 6MB |
| AMD Athlon PRO 300U | 2C/4T | 15W | 2.4/3.3 GHz | Vega | 3 | 1000 MHz | 5MB |
"Built on 12nm manufacturing technology, the new AMD Ryzen PRO 3000 Series mobile processors deliver best-in-class performance and increase productivity by offering up to 16% more multi-threading processor performance than competition.
Specifically, the new AMD Ryzen PRO mobile processors deliver:
- up to 12 hours of general office use or up to 10 hours of video playback,
- up to 14% faster content creation and accelerated everyday office applications with integrated Radeon Vega graphics, from 3D modeling to video editing,
- powerful security features on all Ryzen PRO processors with AMD’s security co-processor built into the silicon,
- and 18-month of image stability, 24-month of processor availability, commercial grade quality, enterprise-class manageability, and 36-month limited warranty to system manufacturers.
AMD is also offering “Zen”-based Athlon PRO mobile processors, bringing a greater choice of mobile computing experiences across the full budget spectrum."
Performance – particularly when GPU acceleration from the integrated Vega graphics is factored in – can be very impressive compared to Intel mobile offerings, with AMD providing these slides to show also the gains over their previous mobile parts:
AMD also lets us know that "premium designs" are coming soon from HP and Lenovo featuring these new CPUs, and considering the dominance of Intel in the high-end notebook market that will be welcome news to AMD fans. No specifics on the upcoming premium laptop models beyond the tease of "coming soon" were provided.
I’d like a Surface Laptop
I’d like a Surface Laptop with that 3700U in it.
That’s a 3700U Pro(Better
That’s a 3700U Pro(Better Binned Part) and sure the graphics would be better along with some Enterprise Friendly APU features enabled but can AMD match Intel’s incentives to OEMs like engineering and marketing assistance.
Maybe M$ could grow a pair but really Intel’s got some lower power Display IP that has to go along with Intel’s CPU offerings for OEMs to get at that Display IP, so that’s the question.
AMD’s really going to have to begin offering some more engineering/marketing assistance and also begin developing some other non APU related Dislay/Other IP to offer to laptop/tablet makers(OEMs) of low powered Tablet/Very-Low-Powered-laptop devices.
And M$’s serface laptops/tablets are also more tied to M$’s more Apple like ecosystem aspirations. AMD needs to be showing some Raven Ridge refrence design tablets to OEM’s to prove that AMD can offer up to OEM’s the levels of technical assistance to OEMs. And that’s because the OEM x86 based Tablet/Laptop market has become dependent on that sort of help from Intel for so many years.
“AMD also lets us know that
“AMD also lets us know that “premium designs” are coming soon from HP and Lenovo featuring these new CPUs, and considering the dominance of Intel in the high-end notebook market that will be welcome news to AMD fans. No specifics on the upcoming premium laptop models beyond the tease of “coming soon” were provided.”
Any OEM business class laptops, or PCs, are what get the Ryzen Pro Branded parts. And the warranties on these parts are 3 years with these parts getting longer periods of SKU availability and support from AMD/OEM. The Pro Ryzen parts are also better binned in order to make the extended warranty period as are the Business Grade PCs/Laptops that come with Ryzen Pro branded parts.
If you want to purchase a PC/Laptop that will last the longest find the Business Class laptops/PCs Makes/Models that are purchased in mass numbers of units by the big enterprise customers via contracts. Those laptops/PCs are getting the longest warrantiies and product support after the sale so the Procesor and MBs and other parts are higher binned parts in order for the extended warranty/product support periods to be met.
Any AMD or Intel processor and PC/Laptop, if the PC/Laptop is business grade and popular with the big enterprise customers, then that’s going to always get better binned CPU/MB parts. The PC/Laptop OEMs can not afford to cheap out on their large institutional buyers so those PC/Laptop SKUs(Business Grade) get the best of everything compared to the consumer grade parts.
There may also be extra CPU features enabled on the Ryzen Pro parts, ditto for Intel’s parts, that are used in Business Class PCs/Laptops. So that’s extra security/management and Processor ISA features enabled also etc.
I wonder if they could put
I wonder if they could put out a dual socket version of the 3700u and crossfire the Vega graphics… You know for shits n giggles
It’s a shame they are not
It’s a shame they are not bringing 7nm cpus to laptops yet. Windows laptops for work are booming at the moment and intel are selling loads but are failing to deliver with very long build times. Orders are taking nearly 2 months which is causing us issues with which vendor.
Well AMD did not barely even
Well AMD did not barely even introduce a 14nm Zen/Vega Based APU(Raven Ridge) until the Ryzen 2000 series Zen+/12nm desktop parts where to market so the Raven Ridge first generation parts started at the 2000 series numbering but on the 14nm/Zen micro arch.
But really AMD for Zen(First generation) had little resources to do otherwise and had to prioritize Zen/Epyc(Naples) first and that very same Epyc Zen/Zeppelin Die was used to make the first generation Desktop Ryzen(Binned Zen/Zeppelin server die) 1000 series parts.
The 2000 series first generation Raven Ridge APUs would have never been picked up by the Laptop OEMs if AMD had given them 1000 series branding so AMD started Zen/14nm Raven Ridge first generation APUs at the 2000 series instead to placate the laptop OEMs.
AMD’s limited resources at the time of First Generation Zen dictated that Server Epyc/Naples had the priority and that’s part of the reason for AMD designing that Server Zen/Zeppelin Modular die that could also be binned down for Desktop market usage. That and Die/Wafer Yields for that Zen/Zeppelin Die was good but also limited at first so any non performant Zen/Zepelin Die production could directly be used for the consumer desktop market for any Zen/Zeppelin die samples that did not make the grade to be used for Epyc/Naples parts.
Eventually AMD will get 7nm APU parts but as always AMD was hamstrung by lack of funds and that still shows up currently in the form of APUs that are behind the Server/Desktop parts in CPU micro-arch and fab process node. Short of having an extra 1 or 2 billion dollars available back then I can never understand what the consumers/gamers expected of AMD as they barely remained in business just getting Zen Server and Desktop out the door along with Polaris, so financially constrained was AMD at that time.
Those Zen/14nm Raven Ridge 2000 series first generation parts had to be made from a non Zen/Zeppelin based custom 4 core Zen CPU/integreted Vega nCUs tapeout that included the Integrated Vega Graphics IP plus Zen CPU IP and that took longer to certify than any purely CPU based design! So that Zen/14 APU’s design had to be frozen at the eariler stage in order to be vetted/certified and available some time after the Zen/Zeppelin based desktop 1000 series parts as well as the Epyc/Naples prioritized parts. The Vega GPU micro-arch was also new so that’s extra time also needed so AMD had to allow even more time for that for Raven Ridge first generation APUs to be Vetted/Certified and to be ready for market.
APUs have always needed longer periods of design vetting/certification compared to purely CPU based SKUs with GPU cores needing design work along side the CPU cores along with the more complicated task of system integration where CPU cores and GPU cores are married on the same die.
ALSO:
What I also do not understand even more is the Technology Press’s not really understanding AMD’s Ryzen Pro Branding and its Business Grade PC/Laptop intended end user market, and it’s not only just one Tech website failing to get Ryzen Pro’s Business/Enterprise market segement mentioned. The 3 year warranty period indicates a better binned part and the Pro variants are OEM parts as far as I can tell and are used in Business/Classs laptops/PCs mostly that come with better parts/3 year warranties and extended product availability/support periods as well compared to consumer Ryzen parts.
One can research at AMD’s website as see that there are more security/management features enabled on the Ryzen Pro Branded poarts to meet the needs of IT departments that are responsible for managing hundreds or thousands of these Business grade PCs/Laptops based on Ryzen Pro SKUs.
Nobody reads your posts.
Nobody reads your posts.
And yet you took the time to
And yet you took the time to reply, and that’s a good indicator that you most likely read the post.
quest4glory is a being disingenuous, Q4G Kawaii!
Most everybody in the Technology Press is really also in the Mindshare business with too many “Tech Reporters” who really do not know their subject matter and are really not very concerned for their reader’s best interests. Most of these blurbs are devoid of most of the salient information as that ends up missing from the articles.
AMD is poor relative to Intel/Nvidia but still AMD can really force both to Intel/Nvidia to get up of their Fat A$$es and inprove their offerings, even though Intel/Nvidia would much rather sit back and milk milk milk!
Now what’s going to happen to low latency and fast responce times with Intel moving away from its Ring Bus to that mesh interconnect that also increases overall latency in the name of scaling to higher core counts.
Poor Gamers so dependent on Latency and Responce for their FPS metrics and most of the games developers unable to code their way out of a wet paper bag.
Gamers better begin to hope for larger L3 caches that are large enough to hold more draw call related code and even some L4 cache on the I/O die/Other to keep more of the essential draw call related game code from being pushed off module/MCM and out onto system DRAM(More Latency). Larger L2 caches on GPUs also with the Raster Back ends direct clients of the GPU’s L2 cache/tiled rendering etc.
And Games/Geming Engine Developers proficient in coding for multi-core CPUs and well as GPUs. Maybe the Discrete GPUs could use some CPU cores of their own and get rid of most of the PCIe related latency inducing encoding/decoding steps.
I skim them once in a while.
I skim them once in a while. Once in a very great while I’ll read the whole thing.
Looks like a very interesting
Looks like a very interesting product line and I can’t wait to see the reviews. It seems to tick the right boxes for a wide arrays of uses:
. Highly integrated
. Decent TDP
. Excellent battery life
So from a hardware perspective it looks good. I just hope this is backed up by decent support (not only AMD but also the OEM’s), as well as competitive pricing.
Thanks for the heads up 🙂
The most important thing
The most important thing about these new APUs is that they have apparently resolved the high idle power issue that the first gen Ryzen mobile parts suffered from.
HP for example are claiming that they now give the same sort of battery life as their Intel equivalents. Which, if true, is going to make the 3500U and 3700U very interesting. Not just for business users, but anybody who wants a long battery life notebook that can also handle some casual gaming.
And being on 12nm, AMD shouldn’t have any supply issues whatsoever.
No supply issues using GF’s
No supply issues using GF’s 12nm process node and TSMC’s 7nm node and even continuing to use GF’s 14nm(Licensed from Samsung) node.
AMD should also be introducing more new Zen Epyc/Naples SKUs on GlobalFoundries(Licensed From Samsung) 14nm node with higher clocks like that 16 core Epyc/Naples 7371(1). AMD can continue adding more higher clocked 14nm Zen Epyc/Naples newer variants even after AMD has Zen-2 Epyc/Rome RTM and in volume production!
There is still the value oriented server/workstation market to consider and more Epyc/Naples competition fruther down the market segement price/performance market for competition against Intel with AMD using Epyc/Naples even after Epyc/Rome is released.
I’d love for AMD to begin offering higher clocked Epyc/Naples 1P(Single Socket) “P” variants even at more affridable price points even after AMD’s Epyc/Rome processors are available. So really AMD can still continue to offer 14nm first generation higher clocked Zen Epyc/Naples offerings targeted at the value oriented server/workstation market and put even more pressure on Intel’s Xeon similar more affordable price oriented server/workstation SKU market segement. Epyc/Naples still offers more PCIe 3.0 lanes(128 on all 1P and 2P Epyc/Naples SKUs) and 8 memory channels per socket.
HP/Other Laptop OEM’s are forced to offer more/better 12nm 2nd generation Raven Ridge 3000 series APU offerings what with Intel’s current consumer CPU supply issues. Intel really cocked up its 10nm process node and took too much 14nm wafer production offline in order to make way for a 10nm node that really has not worked out for Intel. AMD sure is in a good position currently to get some OEM laptop market share back from Intel and maybe laptop OEMs will get smart and not let themselves remain dependent on a single CPU parts supplier like Intel for those Laptop OEMs’ laptop CPU needs.
GF put a lot of work into its 12nm less than half node shrink(2) in addititon to tweaking that 12nm node’s transistor design(2) for better elecrtical performance metrics. So yes GF’s 12nm node can be utilized by AMD in addition to TSMC’s 7nm node.
(1)
“AMD Launches High-Frequency EPYC 7371 Processor”
https://www.anandtech.com/show/13594/amd-launches-highfrequency-epyc-7371-processor
(2)
“VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP”
https://fuse.wikichip.org/news/1497/vlsi-2018-globalfoundries-12nm-leading-performance-12lp/